INARI AMERTRON BERHAD

Established in 2006, Inari Amertron Berhad was listed on the Mainboard of Bursa Malaysia since 2011. Inari provides semiconductor packaging services for global players in Radio Frequency (RF) mobile industry, which include back-end wafer processing and RF testing.

Inari’s finished products are System in Package (SiP) and Quad Flat No-Lead (QFN), key components used in the manufacturing of a wide range of electronic products. Inari’s RF products are used mainly in the wireless telecommunications, including smartphones, 3G devices, cellular phones, and wireless computing peripherals.

With the successful acquisition of Amertron Inc. (Global) in June 2013, Inari’s Optoelectronics products now include, additionally, those used in fiber-optic communications, data centres, automotive and defence, consumer computing devices and industrial automation.

The enlarged Group now has presence in Penang (Malaysia), Kunshan (China), as well as Clark Field (Philippines).