Established in 1994, Qdos is a pioneer manufacturer of Flexible Printed Circuits(FPC) in Malaysia, owned by Suiwah Corp, a Bursa-Malaysia-Listed conglomerate. After twenty years of excellence in FPC design & manufacturing, Qdos has launched a new product family, Molded Interconnect Substrate(MIS), which redefines coreless IC substrates.

MIS is a new technology with huge potential to replace Lead Frame and BGA Substrate. The use of build-up technology and a breakthrough from a conventional polymer core enables MIS technology to produce super fine circuitry and to enable high performance applications, particularly those with 4G, low noise and high frequency requirements.

This cutting-edge technology provides an innovative solution to BGA, QFN, WB and fine pitch FC semiconductor packaging.

QDOS FLEXCIRCUITS SDN. BHD.

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